Posted on 11/07/2019 in 2019
Innovation in silica & inorganic FRs

AnHui Estone Materials Technology has launched new grades of silica and inorganic flame retardants. A hollow silica, with low specific gravity and high sphericity, can reduce the dielectric constant in copper clad laminates (CCL). A chemically porous silica, with low specific gravity, high specific surface area and narrow particle size distribution, can at low loadings improve film properties. The nano-powder inorganic FR can reduce total heat release and smoke density in cables (e.g. achieving China GB31247 B1 in EVA).

“AnHui Estone Materials Technology to launch FR grades & silica at Chinaplas 2019”

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