AnHui Estone Materials Technology has launched new grades of silica and inorganic flame retardants. A hollow silica, with low specific gravity and high sphericity, can reduce the dielectric constant in copper clad laminates (CCL). A chemically porous silica, with low specific gravity, high specific surface area and narrow particle size distribution, can at low loadings improve film properties. The nano-powder inorganic FR can reduce total heat release and smoke density in cables (e.g. achieving China GB31247 B1 in EVA).
“AnHui Estone Materials Technology to launch FR grades & silica at Chinaplas 2019” https://polymer-additives.specialchem.com/news/product-news/anhui-estone-materials-technology-fr-grades-silica-chinaplas-000218386