Posted on 20/07/2016 in News 32 2016
Innovative PIN epoxy molding compound

Henkel offers an “Environmentally Responsible” epoxy heat-cure molding compound for electronics, printed circuit board assembly and other performance adhesive applications, including bridge and axial circuits, TO packages (transistor outline), power discrete and high voltage rectifiers.

Loctite Hysol GR 360A uses fused silica as a filler, achieving UL94 V-0 flammability at 6.2mm thickness. Performance parameters include wide molding latitude, thermal and electrical properties, flexural strength and low moisture absorption.

Henkel electronics:

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