Posted on 15/09/2020 in Electric & Electronic 2020
PIN FR polyamide for 3D-printing

Lehmann&Voss launches a ceramic-filled polyamide for high-temperature extrusion printing, offering UL94-V0 @ 0.4 mm. The material offers printability comparable to polyamide 6, with lower water absorption and higher temperature resistance. Ceramic fillers increase thermal capacity and are compatible with filament production and extrusion printing, such as FFF (fused filament fabrication), without warping. Heated chamber is not required during printing. The material is compatible with HIPS and PVOH support materials. Lehmann&Voss, based in Hamburg, Germany, develops and produces speciality chemicals for now over 125 years.

“LUVOCOM 3F PAHT® – Flame-retardant high-temperature polyamide for 3D printing”

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