PIN FR resin for micro 3-D printing

PIN FR resin for micro 3-D printing

Boston Micro Fabrication and Henkel PIN FR PµSL printing resin micro-precision passes aerospace fire classifications. The PµSL (projection micro stereolithography) technology uses UV polymerisation of the Henkel liquid resin to achieve accurate 3D printing resolutions...
Non-hazardous FR package for PC-GF

Non-hazardous FR package for PC-GF

ROMIRA flame retardant, GF-reinforced PC blend with non-halogenated, non-hazardous or non-SVHC-listed additives. ROMIRA (ROWA GROUP) has developed a 10% glass fibre reinforced polycarbonate blend which can meet  UL 94 V-0 (1.5 mm) and offers good mechanical...
High-temperature 3D-print resin

High-temperature 3D-print resin

Liqcreate photopolymer resin delivers non-halogenated, self-extinguishing fire performance & high-temperature resistance. The resin is adapted for DLP (digital light processing), LCD and laser 3D-printers with 385-420 nm precision. Temperature resistance is HDT-B...
Nitrogen phosphorus PIN FR for TPU

Nitrogen phosphorus PIN FR for TPU

Study proposes N-P flame retardant, derived from phenyl hypophosphite, achieving UL 94 V-0 (3.2 mm) in TPU (thermoplastic polyurethane). Phenyls hypophosphite was reacted with N, N’-bis(salicylidene)ethylenediamine, to produce a Schiff-base derivative (SMAE). At...
Amine-reacted APP PIN FR

Amine-reacted APP PIN FR

A Schiff base (an amine nitrogen compound) was reacted with ammonium polyphosphate (APP) achieving UL 94 V-0 (3 mm) at 17% loading in unsaturated polyester. 1,2-bis(2-aminoethoxy)ethane and terephthalaldehyde (TPA) were reacted with APP in ethyl acetate at 65°C to...